-40%

Thermal Grease Heatsink Power Transistors Diodes Semiconductor, Grease 04, 250gm

$ 52.79

Availability: 805 in stock
  • Type: Thermal Compound
  • Item must be returned within: 14 Days
  • All returns accepted: Returns Accepted
  • MPN: AA-GREASE 04
  • Typical application 3: Automotive temperature-sensing devices.
  • Packaging: Syringe
  • Typical Applications 5: silicone controlled rectifiers Power transistors
  • Return shipping will be paid by: Buyer
  • Typical Applications 7: Hardware Telecommunications Right product Thermal
  • Typical Applications 2: CPU to heat sink Temperature sensors.Potting
  • Typical Applications 8: High-voltage corona suppressant Transferors
  • Brand: Atom Adhesives
  • Typical Applications 6: semiconductors Thermal Joints TEC Modules
  • Country/Region of Manufacture: United States
  • Refund will be given as: Money Back
  • Typical Applications 1: Effective thermal coupler for any heat sink device
  • Typical applications 4: base and mounting studs of transistor, diodes
  • Condition: New

    Description

    Technical Product Bulletin
    5 Grams Arctic Silver Comparable Thermal Compound Paste - Super Conductive USA PR
    PRODUCT DESCRIPTION:
    Heat sink thermally conductive grease compound, used successfully by Ford Motor Company for 20 years, direct replacement for Dow
    340 and
    Wakefield 120,
    complies to MIL-DTL-4-7113, less than 30µ particle size, low
    bleeding, low VOC.
    This product is an opaque
    white heat sink
    grease compound, which is applied to the base
    and mounting studs of transistor
    and diodes to provide
    a positive heat
    sink seal, this
    facilitates
    heat transfer away from electrical/electronic components and
    into heat sinks,
    thereby increasing the
    overall
    efficiency and performance of the
    device.
    It is grease like
    silicone material,
    heavily filled with efficient heat conductive zinc oxide and
    a binding agent,
    this combination promotes
    high thermal
    conductivity, high temperature stability, and the
    lowest amount of bleed and
    evaporation.
    This thermal compound resists
    changes in
    consistency temperatures up to 180°C; function as heat transfer media, durable
    dielectric
    insulation,
    barrier
    against
    environmental contaminants and as a stress-relieving shock and
    vibration absorber over a wide
    temperature and humidity
    range.
    This thermal paste is
    resistant to ozone and ultraviolet degradation and has good chemical and solvent
    stability,
    good
    interference between the
    heat
    producing device and the heat transfer media,
    and low
    surface tension that enables them to
    wet most surfaces. It will not harden, dry, or
    melt after
    1200 hours @ 205°C.  Used by Ford Motors for over 10 years.
    ELECTRICAL PROPERTIES:
    Dielectric Strength, volts/mil (ASTM D 150)
    390
    Dielectric Constant @ 100Hz (ASTM D150)
    4.40
    Dissipation Factor @ 100Hz (ASTM D150)
    0.0021
    Volume Resistivity, ohm-cm (ASTM D257)
    2.9x10
    14
    THERMAL PROPERTIES:
    Thermal Conductivity W/m-K
    0.88
    Operating Temperature Range, °C
    -60 to 205
    Thermal Resistance °C-In2 /W
    0.05
    TYPICAL PROPERTIES AND CHEMICAL CHARACTERISTICS:
    Color
    White
    Base Fluid
    Dimethyl Polysiloxane
    Filler
    Zinc oxide
    Specific Gravity, 25°C, gm/cc
    2.45
    Viscosity
    Paste
    Press Flow @ 42.5 PSI, 25°C sec
    13
    Penetration (Worked), mm
    2851/10
    Evaporation 24 hrs @25°C, %
    0.0
    Evaporation @ 200°C 24H by weight,%
    0.5
    Bleed 24 Hours, %
    0.6
    POTENTIAL USES:
    ·      Effect
    i
    ve
    the
    r
    mal
    c
    o
    up
    ler
    f
    o
    r any
    heat
    sink d
    e
    vic
    e
    , CPU
    to
    h
    eat si
    n
    k
    ·
    A
    u
    t
    o
    m
    o
    t
    i
    ve
    t
    e
    m
    p
    er
    a
    tur
    e
    -
    s
    ensi
    n
    g
    de
    v
    i
    c
    es
    ·
    Tem
    p
    erature
    sen
    s
    o
    rs
    ·      A
    p
    p
    l
    i
    ed to
    the ba
    s
    e a
    n
    d
    m
    o
    un
    ti
    n
    g
    st
    ud
    s
    o
    f tra
    n
    sist
    o
    r
    , dio
    d
    es
    a
    n
    d
    sil
    i
    c
    o
    n
    e c
    o
    n
    tr
    o
    l
    l
    ed re
    c
    tifiers
    ·
    P
    o
    wer
    tra
    n
    sis
    t
    o
    rs
    ·
    Dio
    d
    e
    s,
    s
    e
    m
    i
    c
    o
    ndu
    c
    t
    o
    rs
    ·
    Thermal
    Joi
    n
    ts
    ·
    For any
    de
    v
    i
    ce
    where
    eff
    i
    c
    i
    ent
    c
    oo
    l
    in
    g
    is
    re
    qu
    ired
    ·
    P
    o
    tti
    n
    g
    ·
    TEC
    M
    o
    du
    les
    ·
    H
    ar
    d
    ware
    ·
    Tele
    co
    mm
    un
    ic
    a
    ti
    o
    n
    s
    ·
    Ri
    gh
    t
    p
    ro
    du
    ct
    f
    o
    r
    the
    r
    mal
    ma
    n
    a
    g
    e
    ment
    ·
    H
    i
    gh-
    v
    o
    lta
    g
    e
    c
    o
    r
    o
    n
    a su
    p
    p
    r
    essant in
    c
    o
    nn
    e
    c
    t
    o
    r
    s
    f
    o
    r fly
    b
    ack
    tra
    n
    sfe
    r
    o
    rs
    l
    o
    c
    a
    ted
    in TV s
    e
    ts.
    ·
    N
    o
    n-
    S
    a
    g
    o
    r f
    l
    o
    wing
    ·
    N
    o
    n-H
    a
    z
    ar
    d
    o
    u
    s po
    l
    y
    meri
    z
    a
    ti
    o
    n
    ·
    N
    o
    n-
    T
    o
    xic
    ·
    N
    o
    n-
    Cor
    r
    o
    si
    v
    e
    ·
    Re
    w
    o
    rka
    b
    le
    ·
    Easily
    r
    e
    m
    o
    ved
    ·
    N
    o
    n-
    F
    l
    a
    m
    ma
    b
    le
    ·
    Easy
    to
    a
    pp
    ly
    via
    d
    is
    p
    ensi
    n
    g
    o
    r s
    c
    reen pr
    in
    ti
    n
    g
    ·
    L
    o
    w
    su
    r
    fa
    c
    e
    t
    ensi
    o
    n
    that
    e
    n
    a
    b
    les it
    t
    o
    wet
    m
    o
    s
    t su
    r
    f
    a
    ces, which
    can
    l
    o
    w
    er the
    t
    h
    e
    r
    m
    al c
    o
    n
    t
    a
    ct
    r
    esistan
    c
    e
    b
    e
    tw
    e
    en the s
    ub
    stra
    t
    e
    a
    n
    d
    ma
    t
    eria
    l
    .
    APP
    L
    I
    C
    A
    T
    ION
    ME
    T
    HODS:
    A
    u
    t
    o
    mated
    o
    r
    ma
    nu
    al
    d
    is
    p
    ensi
    n
    g
    U
    S
    A
    G
    E
    I
    N
    S
    TR
    U
    C
    T
    I
    O
    NS:
    For i
    ndu
    strial
    use
    o
    n
    l
    y
    R
    e
    a
    d
    M
    SDS
    carefu
    l
    ly
    pr
    i
    o
    r
    to
    u
    se.
    LIMITATIONS
    :
    This compound is neither tested nor represented as suitable for medical or pharmaceutical use.
    S
    T
    OR
    A
    GE
    H
    A
    N
    D
    L
    I
    N
    G &
    S
    HELF
    L
    IFE:
    This product
    has
    a shelf
    life
    o
    f
    5
    years
    at
    r
    o
    o
    m
    t
    e
    m
    p
    er
    a
    ture (76°
    F
    )
    in an
    u
    n
    o
    p
    e
    n
    ed
    c
    o
    n
    t
    ai
    n
    er, s
    e
    ttl
    ing
    s
    may
    o
    c
    cur
    du
    ri
    n
    g
    l
    o
    n
    g
    te
    r
    m
    s
    t
    o
    ra
    ge
    ,
    it
    is
    re
    com
    men
    d
    ed
    t
    o
    r
    e
    -
    m
    i
    x the filler
    b
    y ha
    n
    d
    o
    r
    mech
    a
    n
    ical
    m
    ixi
    n
    g.
    Keep
    c
    o
    n
    t
    ai
    ne
    r ti
    gh
    tly
    c
    l
    o
    sed
    s
    t
    o
    re in
    c
    o
    o
    l
    area a
    w
    ay
    f
    r
    o
    m
    i
    gn
    it
    i
    o
    n
    s
    o
    u
    rces
    and
    o
    xi
    d
    i
    z
    ers,
    n
    o
    s
    p
    ecial p
    r
    ecaut
    i
    o
    n
    s
    n
    eed
    t
    o
    b
    e tak
    e
    n
    if p
    r
    o
    du
    ct
    i
    s ha
    n
    d
    led
    acc
    o
    r
    d
    i
    n
    g
    t
    o
    di
    r
    e
    ct
    i
    o
    n
    s. S
    h
    elf l
    i
    fe is i
    nd
    ica
    t
    ed
    o
    n
    the
    p
    r
    o
    d
    u
    ct
    la
    b
    el, a
    n
    y
    sp
    e
    cial
    s
    t
    o
    r
    a
    g
    e a
    n
    d
    ha
    n
    d
    l
    in
    g i
    n
    structio
    n
    s
    will
    b
    e
    p
    r
    in
    ted
    o
    n
    the p
    r
    o
    d
    u
    ct c
    o
    n
    tai
    n
    er
    la
    b
    el.
    CLEAN UP & DISPOSAL
    :
    This product can be removed by using solvents such as mineral spirit, heptane, or isopropyl alcohol. Dispose of in accordance with local,
    state
    and federal regulations for hazardous
    waste.
    SHIPMENT & PACKAGING:
    U.S made quality product - We ship internationally.  Multiple use syringe with cap.  This formulation is comparable to or
    better than Arctic
    Silver.
    Thermal Fluid
    : Silicone
    Filler:
    Zinc Oxide and Binder Agent
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