-40%

Super Thermal Conductive Epoxy Electrically Insulating Heatsink 195, 1.5gm

$ 5.8

Availability: 12 in stock
  • Substrates 1: metals, silica, alumina, sapphire, ceramics, glass
  • Return shipping will be paid by: Buyer
  • Brand: Atom Adhesives
  • All returns accepted: Returns Accepted
  • Keywords 1: extreme thermal cooling integrated circuits
  • Usage:: 1 time use product
  • Type: Thermal Compound
  • Item must be returned within: 14 Days
  • MPN: AA-SUPERTHERM 195-1
  • Keywords 3: heat sensitive components to printed circuit board
  • Condition: New
  • Packaging: Pouch
  • Keywords 4: strong, durable, high impact bonds
  • Refund will be given as: Money Back
  • Substrates 2: plastics and many other materials
  • Typical Applications:: CPU, Heat sink, and sensitive electronic apps
  • Country/Region of Manufacture: United States
  • Keywords 2: staking transistors, diodes, resistors

    Description

    Technical Product Bulletin
    SUPER THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
    PRODUCT DESCRIPTION:
    AA-SUPERTHERM 195
    is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors,
    integrated circuits and other heat sensitive
    components to printed circuit boards. This adhesive develops strong, durable, high impact
    bonds at room temperature which improve heat
    transfer while maintaining electrical insulation.
    AA-SUPERTHERM 195
    bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other
    materials, because its coefficient of thermal
    expansion provides a good match for those materials over a fairly wide temperature range.
    Fully cured
    AA-SUPERTHERM 195
    provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals
    including petroleum solvents, lubricating oils, and
    alcohol.
    This adhesive complies with the requirements of NASA Outgassing
    Specification when tested according to
    ASTM E-595-90
    .
    PRODUCT DESCRIPTION:
    Appearance
    White
    Cure Type
    Heat cure or Room Temperature
    Benefits
    ·         Strong
    ·         Durable
    ·         high-impact bonds
    ·         Fully cured
    ·         Excellent resistance to  many chemicals
    Mix Ratio by weight
    100:15 / Resin:Hardener
    Substrates
    metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials
    Operating Temperature
    Continuous: - 55°C to 275°C
    Intermittent: - 55°C to 375°C
    Typical Application
    Extremely sensitive thermal cooling applications
    CURE SCHEDULE:
    2 – 4 Hours
    @ 65°C
    24 Hours
    @ 25°C
    MISC PROPERTIES:
    CTE, linear
    22.2  µin/in-°F @ RT
    Hardness, Shore D
    80
    Adhesive Bond Strength
    1700 psi
    UNCURED PROPERTIES:
    Viscosity
    @ 25 °C, 77.0 °F
    5000 cP
    Specific Gravity, mixed
    1.30 g/cc
    Pot Life
    60 minutes
    Solid Content
    100%
    Outgassing, NASA, %CVCM
    0.02
    (3 hrs @ 65°C)
    Outgassing, NASA, %TWL
    0.6
    (3 hrs @ 65°C)
    THERMAL PROPERTIES:
    Thermal Conductivity
    13.9 BTU-in/hr-ft²-°F
    Glass Transition Temp, Tg
    54.0 °C,  129 °F
    Maximum Service Temperature, Air
    115 °C,  239 °F
    Minimum Service Temperature, Air
    -70.0 °C,  -94.0 °F
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply AA-SUPERTHERM 195 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure
    is adequate for strong, reliable bonds; however,
    maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping
    container be thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30
    minutes prior to mixing components may be
    necessary. Crystallized epoxy components do not react as well as liquid components and should be
    re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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