-40%

Super Conductive Thermal Adhesive Compound CPU Heatsink , 195, 1.5gm

$ 5.8

Availability: 57 in stock
  • Substrates 1: metals, silica, alumina, sapphire, ceramics, glass
  • Condition: New
  • Country/Region of Manufacture: United States
  • MPN: AA-Supertherm 195-1
  • Keyword 2: Heat cure or Room temperature
  • Keyword 3: heat sensitive components to printed circuit board
  • Keyword 1: extreme thermal cooling integrated circuits
  • keywords 4: strong, durable, high impact bonds
  • Usage:: CPU, Heat-sink, sensitive electronic applications
  • Brand: Atom Adhesive
  • Type: Thermal Compound
  • Packaging: Pouch
  • Substrates 2: plastics and many other materials

    Description

    Technical Product Bulletin
    SUPER THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COOLING EPOXY
    Note
    :
    This product is a one time use product.
    THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
    PRODUCT DESCRIPTION:
    AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
    AA-SUPERTHERM 195 bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range.
    Fully cured AA-SUPERTHERM 195 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
    This adhesive complies with the requirements of NASA Outgassing Specification when tested according to ASTM E-595-90.
    GENERAL PROPERTIES
    Appearance
    White
    Cure Type
    Heat cure or Room Temperature
    Benefits
    Strong
    Durable
    High-impact bonds
    Fully cured
    Excellent resistance to many chemicals
    Mix Ratio by weight
    100:15 / Resin:Hardener
    Substrates
    metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials
    Typical Applications
    Extremely sensitive thermal cooling applications
    Shelf Life
    1 Year
    CURE SCHEDULE
    2 ? 4 Hours
    @ 65°C
    24 Hours
    @ 25°C
    MISC PROPERTIES
    CTE, linear
    22.2 µin/in-°F @ RT
    Hardness, Shore D
    80
    Adhesive Bond Strength
    1700 psi
    UNCURED PROPERTIES
    Viscosity @ 25 °C, 77.0 °F
    5000 cP
    Specific Gravity, mixed
    1.30 g/cc
    Pot Life
    60 minutes
    Solid Content
    100%
    Outgassing, NASA, %CVCM
    0.02 (3 hrs @ 65°C)
    Outgassing, NASA, %TWL
    0.6 (3 hrs @ 65°C)
    THERMAL PROPERTIES
    Thermal Conductivity
    13.9 BTU-in/hr-ft²-°F
    2.00 W/m-K
    Glass Transition Temp, Tg
    54.0 °C, 129 °F
    Maximum Service Temperature, Air
    115 °C, 239 °F
    Minimum Service Temperature, Air
    -70.0 °C, -94.0 °F
    Operating Temperature
    -40°C to 175°C
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1) Carefully clean and dry all surfaces to be bonded.
    2) Apply AA-SUPERTHERM 195 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
    4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.