Silicone Thermal Compound Cooling Paste Grease Syringe Processor F4Z1 New Z6Q6

Description

Description
Features
Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heat sink in order to keep your CPU from overheating.
This thermal grease can be used on the rear side of the heat sink which has no thermal pad.
It will improve the heat dissipation.
This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU heat sink.
This ensures that the heat to the sink and fans can work at their full capacity to remove the harmful heat away from the CPU, and prevents burnout or heat damage.
Specifications
Type: Silicone Fluid with 20% Metal Oxide
Thermal conductivity: 1.829 W/m-k
Thermal resistance: 0.123 C-in2/w
Dielectric Breakdown: 5.0 KV ac
Paste Colour: Grey
Package Contents
Grey Heat Sink Thermal CPU Compound PC Grease Paste