Silicone heat conducting paste best thermal compound KPT-8.

Description

KPT-8 (Silicone Heat transfer paste) - thermal compound produced according to GOST 19783-74.Used to improve the thermal conductivity between the fuel elements of electronic circuits (processors, power transistors, diodes) and the radiator. Is a heat-resistant white mass of high viscosity. It turns thickening polydimethylsiloxane fluid zinc oxide powder. In many studies of Russian KPT-8 is used as the best thermal interface.
Specifications:
White.
Explosion-proof, non-flammable, chemically inert, has no irritating or toxic to humans.
Corrosive effects: lack of greenery on a copper plate in 24 hours
Operating temperature range: -60 to +180 °C.
Density: 2.6-3.0 g / cm ³.
Volume resistivity: no less than 1012 ohm-cm
Breakdown voltage for layer 1 mm and a frequency of 50 Hz: at least 2 MV / m
The relative dielectric constant (up to):
50 Hz - 6.0;
1 MHz - 4.0;
10 MHz - 4.8.
Penetration: 150.
Dielectric strength: 2.0-5.0 kV / mm.
Dissipation factor at 10 MHz: no more than 0,005.
Dynamic viscosity at 20 ° C: 130-180 Pas.
Radiation resistance: The allowable cumulative dose - 1,25 × 108 rad.
Thermal conductivity, W / (m · K), at least:
-50 ° C - 1,0;
20 ° C - 0,7;
100 ° C - 0,65.