Plaster Thermal Silicone Cooling Paste Strong Adhesive Compound Glue H6Q2

Description

Description
product description
Product parameters:
Melting capacity: 0 (200C/24Hours)
Evaporation capacity: o.001% (200C/24Hours)
Thermal conductivity: 0.671W/m-K
Thermal impedance: 0.06
Setting time: 3min (25℃)
Bonding strength: 25Kg
Insulation factor5.1
Dissipation coefficient0.005
Independent vacuum packaging
Scope of application:
It has a high-strength, fast-speed bonding effect, and is suitable for various components that need to be directly bonded firmly, LEDs and heat sinks, etc.
1. Used as a heat transfer medium for electronic components.
2. Computer CPU, GPU (graphics card chip) and radiator gap filling and heat conduction.
3. The filling of the gap between the high-power transistor and the aluminum and copper substrates.
4. The filling of the gap where the silicon controlled element diode contacts the aluminum and copper substrates.
5. Reduce the working temperature of various heating elements, etc.
Product performance:
Good thermal conductivity, strong adhesion. Vacuum package is not easy to oxidize and dry out. Good viscosity. Short drying time. Good performance. Various chips are recommended for heat dissipation.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good conductivity and a wide temperature range (-60200℃).
It can withstand high temperature of 300℃ in a short time. In addition, it has short surface curing time, strong adhesion, long storage period, non-toxic, solvent-free, and can be safely used in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instrumentation, LED, heat sink and other industries.
Instructions:
1. When using, directly squeeze out the product, rub it with the surface of the adherend, and cover it immediately after use, in case it is tried again;
2. The surface fixation speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object with solvent (such as alcohol) before use. Do not use detergent to clean it. Do not apply it until the surface is clean.
Packing specification: 5g/piece (packing has good air tightness, and the outer vacuum bag isolates the air, which increases the storage time).
Package Includes:
1x Heatsink Plaster