LOT (1000) Indium Corp HEAT SPRING Pure Indium Thermal Pad 1.5"x1.5"

Description

This is a spool of
(1000) Heat-Spring textured pads made of pure Indium ideal for electronics thermal applications.
These were packed in (very) late 2013, at the time they cost over .50 each. Note they are technically "expired" in 2015, though I am having a hard time understanding how a pure metal would expire.
This will be shipped UPS Ground to USA only, in the original packaging, no outer packaging will be added.
Each pad weighs 1.4 ~ 1.5 grams, and this is 99.9% pure Indium.
They are 1.5 inches square an 0.006 inches thick which I think comes out to  ~0.15mm or ~150 microns. Note these are not plain foil, they are like a waffle texture.
This is Indium Corporation's proprietary Heat-Spring brand product:
Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi.
An SMA-TIM (soft metal alloy) made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow (conductance). Our patented Heat-Spring® technology further reduces the thermal resistance and enhances cooling.
Indium's high-end thermal interface materials deliver superior performance over time. Because SMA-TIM products are made of metal, they cannot experience pump out problems - even under power cycling. Our Heat-Spring® material, which does not contain silicone, conforms to surface disparities, reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also does not bake out.