Innovative IC DIAMOND 7 CARAT 1.5 Gram Thermal Compound

Description

IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity. Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive. Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight, 94% after 10 minute dry-out prior to heat sink installation.
Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling. Superior bulk conductivity Excellent thermal impedance Tight particle distributions less than 40 maximum particle diameter Silicone free Lower viscosity Greater stability Non capacitive or electrically conductive
MANUFACTURER PARTS NUMBER: IC Diamond 7 Carat
PRODUCT SPECIFICATION:
Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 BLT
Average Particle Size: less than 40 maximum particle diameter Compliancy: RoHS Compliant.
UPC:
094922129062
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Other (Budget)    Usually arrives within 11 to 14 business days
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