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Antec High Thermal Conductivity Nano Diamond Thermal Compound, Formula X 4Gram

$ 6.33

Availability: 100 in stock
  • All returns accepted: Returns Accepted
  • Return shipping will be paid by: Seller
  • Model: 8541602425
  • Refund will be given as: Money Back
  • Item must be returned within: 30 Days
  • Condition: New
  • Item model number: 8541602425
  • Package Dimensions: 7.2 x 2.72 x 0.67 inches; 0.63 Ounces
  • Type: Does not apply
  • Manufacturer: Antec
  • EAN: 0711181939392
  • UPC: 7445040596558
  • package_length: 2.72
  • Color: Does Not Apply
  • Is Discontinued By Manufacturer: No
  • MPN: Does Not Apply
  • Brand: Antec
  • Material: Diamond

    Description

    Antec Thermal Paste, High Performance Heatsink Paste for All CPU Coolers, High Durability and Easy to Apply - 4 Grams,Formula
    Free Shipping!
    Product Description:
    High Thermal Conductivity (11 w/mk) , dissipated the heat efficiently which generated from the CPU
    Top performance suitable for extreme environments (-30~240℃) and applications
    Exceptional long term stability , odorless , non-volatile , non-corrosive , not electrically conductive,Super adhesion makes the thermal paste closely adhere to the surface
    A 3.5g gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5g gram syringe will cover approximately 16 square inches
    Easy & safe for the user , even for the beginner with our enclosed tools (Scraper, Grease Rag, Fingertip etc.)
    Product Description
    A 3.5g gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5g gram syringe will cover approximately 16 square inches
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    100% AUTHENTIC PRODUCT OR YOUR MONEY BACK GUARANTEE!
    100% satisfied customers. It says it all.
    Thank you for shopping with us!