3M Thermal Interface Pad 50x50X 1.0 mm(Electronics Grade)

Description

Notable for its high performance and high durability, this Thermally Conductive Pad is designed to operate continuously at 140C. and also has exceptional mechanical and physical characteristics. Surfaces are pliable to allow complete surface contact to enhance heat dissipation. Innovation Cooling Custom die cuts this 3M (5519) product for both retail  and commercial use to suit your application.
Very high thermal conductivity (4.9 W/m-K)
Hardness :Shore 00 = 70
Good softness and conformability even to non-flat surfaces
Slight tack allows pre-assembly. Good wettability for better thermal conductivity
Product Description
3M? Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Key Features
Very high thermal conductivity and good electrical insulation properties.
Good softness and conformability even to non-flat surfaces.
Good electrical insulation properties.
Good flame retardant, UL94 V-0 equivalent material
Compression relaxation properties help reduce pressure to electric components.
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance
Note
:Not suitable for
Application  to CPU's and GPU's