-40%
30 Gram SILVER COOLING / High Performance Thermal Grease Compound Paste Syringe
30 Gram SILVER COOLING / High Performance Thermal Grease Compound Paste Syringe
30 Gram SILVER COOLING / High Performance Thermal Grease Compound Paste Syringe

30 Gram SILVER COOLING / High Performance Thermal Grease Compound Paste Syringe

$ 3.08

Availability: 100 in stock
  • Compatible Brand: For Acer, For Alienware, For Apple, For ASUS, For Averatec, For Clevo, For Compaq, For Dell, For eMachines, For Everex, For Gateway, For GIGABYTE, For HP, For IBM, For Lenovo, For LG, For Micron, For MSI, For Samsung, For Sony
  • Moment Bore Temperature: -50-280
  • Operation Temperature: -30-230
  • Fan Diameter: all
  • Fan Light Color: Multicolor
  • Maximum Fan Speed: All
  • Type: Thermal Compound
  • Silicone Compounds: 20%
  • Specific Gravity: 1.35
  • Thermal Resistance: <0.067 C-in2/W
  • Packaging: Syringe
  • Thermal Conductivity: >3.17W/m-k
  • UPC: 6971355447229
  • MPN: SILV30G1X, HY710, CPU GPU VGA LED Heatsink Fan, Chipset Chip Heat Spreader, With Pure Silver, Conductive 30g gram, xbox-ps4-pc-laptop-cpu-processor-desktop, motherboard-heat-spreading-led-vga-gpu
  • Material: Silver AGO & Silver Powder-High Cooling Material
  • Maximum Airflow Volume: All
  • Thixotropic Index: 350+/-10
  • Brand: HALNZIYE
  • Carbon Compounds: 20%
  • To Fit: VGA, GPU, LED, Heatsink, Chipset, Chip, Chipset - Northbridge, Chipset - Southbridge, GPU Processor
  • Color: Silver
  • Power Connection: None
  • Condition: New
  • Metal Oxide Compounds: 60%

    Description

    Silver Cooling High Performance Thermal Grease Compound Paste Syringe.  For CPU GPU VGA LED Heatsink Fan Chipset Chip Heat Spreader.
    Low Thermal Resistance / High Conductivity for heat transfer / High Density
    HY700 series Silver Thermal Grease contains Silver AGO & Silver Powder-High Cooling Performance Material To Improve Thermal Conductivity, Better than Regular Types and Good Partner For CPU / VGA Cooler
    Compliance with RoHS REACH PFOS requirements
    Thermal Conductivity:
    >3.17W/m-k
    Thermal Resistance:
    <0.067 C-in2/W
    Color:
    Silver
    Thermal Conductivity:
    >3.17
    Thermal Impendance:
    <0.067
    Specific Gravity:
    1.35
    Thixotropic Index:
    350+/-10
    Moment Bore Temperature:
    -50-280
    Operation Temperature:
    -30-230
    Ingredients:
    Silicone Compounds:
    20%
    Carbon Compounds:
    20%
    Metal Oxide Compounds:
    60%
    Warning: This is not a Glue!! The sole purpose of this paste is to stay moist and provide additional cooling.
    Warning: If this paste does not provide additional cooling, then there is a problem with either a Circuit Board due to bad capacitors or a short, or is in CPU / GPU Chip due to solder cracking and chip damage because of overheating for significant period of time.